Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating

Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating

  • CN 102,621,814 A
  • Filed: 04/11/2006
  • Published: 08/01/2012
  • Est. Priority Date: 04/19/2005
  • Status: Active Application
First Claim
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1. a lower membrane forms composition, is the composition that is used for being formed on through rayed the lower membrane that the lower floor of the photoresist of the photoetching process of making semiconductor device uses, and contains polymerism material and Photoepolymerizationinitiater initiater,Above-mentioned polymerism material is the polymerizable compound with ethylenic unsaturated bond of at least one free redical polymerization, and above-mentioned Photoepolymerizationinitiater initiater is the optical free radical polymerization initiator.

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