Copper alloy sheet material having low young's modulus and method for producing same

Copper alloy sheet material having low young's modulus and method for producing same

  • CN 102,630,251 A
  • Filed: 12/01/2010
  • Published: 08/08/2012
  • Est. Priority Date: 12/02/2009
  • Status: Active Application
First Claim
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1. electric, electronic component-use copper alloy plate;

  • It has alloy compositions;

    Said alloy compositions comprises;

    total amount is the Ni of 0.5 ~ 5.0 quality % and any or two kinds among the Co, and the Si of 0.2 ~ 1.5 quality %;

    Surplus is Cu and unavoidable impurities, and wherein, this copper alloy plate in 0.2% ys of rolling direction is more than the 500MPa, electric conductivity is more than the 30%IACS, Young'"'"'s modulus is below the 110GPa, flexibility factor is below the 105GPa.

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