Suspension electrical base board, suspension for hard disk and hard disk drive

Suspension electrical base board, suspension for hard disk and hard disk drive

  • CN 102,652,338 B
  • Filed: 12/02/2010
  • Issued: 05/04/2016
  • Est. Priority Date: 12/18/2009
  • Status: Active Grant
First Claim
Patent Images

1. a suspension electrical base board, is characterized in that,Possess:

  • Metallic support substrate;

    The first insulating barrier, is disposed on described metallic support substrate, is made up of insulating materials;

    Conductor layer, is disposed on described the first insulating barrier, forms wiring;

    AndThe second insulating barrier, is disposed on described the first insulating barrier and conductor layer, formed by insulating materials,Be provided with the first insulated openings portion at described the first insulating barrier,At described metallic support substrate, on described conductor layer bearing of trend, be provided with metallic support base openings portion with described the first insulated openings portion overlapping position, the back side of exposing described conductor layer,At described the second insulating barrier, on described conductor layer bearing of trend, be provided with the second insulated openings portion with described the first insulated openings portion overlapping position, the surface of exposing described conductor layer,Using the length on described conductor layer bearing of trend of described the first insulated openings portion as L1, using the length on described conductor layer bearing of trend of described metallic support base openings portion as L2, using the length on described conductor layer bearing of trend of described the second insulated openings portion as L3When position corresponding with described the first insulated openings portion in described conductor layer is applying load from described the second insulating barrier to the thickness direction of described metallic support substrate, in the time that the described metallic support substrate-side of described conductor layer engages with external circuit substrate, using the stress that results from described conductor layer in the position corresponding with the periphery of described the first insulated openings portion as the first stress F1, using the stress that results from this conductor layer in the position corresponding with the periphery of described metallic support base openings portion as the second stress F2, using the stress that results from described conductor layer in the position corresponding with the periphery of described the second insulated openings portion as tertiary stress F3Situation under, make L1

    L2And L3Become L1

    L3

    L2

    L2

    1.35×

    L1, making becomesF1

    F3And F1

    F2

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