New process for double-side lithography etching

New process for double-side lithography etching

  • CN 102,662,304 A
  • Filed: 01/25/2007
  • Published: 09/12/2012
  • Est. Priority Date: 01/25/2007
  • Status: Active Application
First Claim
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1. new process of double-faced micro-shadow etching comprises following steps at least:

  • A. form a conductive layer and a lower conductiving layer on after the two sides of a substrate being plated conductive metal layer;

    B. impose a salvo in this lower conductiving layer;

    C. a photoresist evenly is coated on conductive layer on this, forms a photoresist layer;

    D. above this photoresist layer, cover a light shield and with the specific wavelength rayed;

    E. clean with a developer, stay a patterned light blockage layer;

    F. remove the conductive layer of this patterned light blockage layer and the protection of this salvo with an etching solution.

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