Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same

Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same

  • CN 102,666,014 A
  • Filed: 01/20/2011
  • Published: 09/12/2012
  • Est. Priority Date: 03/12/2010
  • Status: Active Grant
First Claim
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1. a suspension is characterized in that, contains abrasive particle and water, and said abrasive particle contains 4 valency cerium hydroxide particles, and is adjusted in the aqueous dispersions of 1.0 quality % at the content with this abrasive particle, for the light of wavelength 500nm the light transmittance more than the 50%/cm is arranged.

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