semiconductor device, method of manufacturing the same, and method of manufacturing wiring board

semiconductor device, method of manufacturing the same, and method of manufacturing wiring board

  • CN 102,693,951 A
  • Filed: 03/16/2012
  • Published: 09/26/2012
  • Est. Priority Date: 03/23/2011
  • Status: Active Application
First Claim
Patent Images

1. a semiconductor device comprises pedestal, and said pedestal comprises:

  • Be formed on the electrode pad part of substrate the barrier metals layer andThe core of upper surface that is formed on said barrier metals layer is to have the weld layer of the external diameter littler than the external diameter of said barrier metals layer.

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