Light emitting diode package and method for manufacturing the same

Light emitting diode package and method for manufacturing the same

  • CN 102,694,107 A
  • Filed: 03/22/2012
  • Published: 09/26/2012
  • Est. Priority Date: 03/22/2011
  • Status: Active Grant
First Claim
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1. light emission diode package member, said light emission diode package member comprises:

  • Substrate;

    Semiconductor structure layer is arranged on the surface of substrate, and comprises first kind semiconductor layer, active layer and the second type semiconductor layer;

    First projection and second projection, first projection are arranged on the first kind semiconductor layer, and second projection is arranged on the second type semiconductor layer;

    Protective layer covers semiconductor structure layer at least;

    The first projection pad and the second projection pad are arranged on the protective layer, and the first projection pad is connected to first projection, and the second projection pad is connected to second projection.

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