Packages and methods for packaging microphone devices

Packages and methods for packaging microphone devices

  • CN 102,740,205 A
  • Filed: 12/16/2011
  • Published: 10/17/2012
  • Est. Priority Date: 04/04/2011
  • Status: Active Application
First Claim
Patent Images

1. assembly comprises:

  • The sonic transducer parts;

    It has outer cover and the sonic transducer that is arranged in said outer cover;

    Said outer cover comprises the rigid substrates with each other relative first surface and second surface;

    Wherein said outer cover has exterior top surface, and the second surface of wherein said rigid substrates is arranged to the outside bottom surface as said outer cover, and wherein electric terminal is positioned on the second surface of said rigid substrates;

    AndFlexible base, board;

    It has first and second portion;

    And between said first and said second portion, be flexible at least;

    Each part has relative side, and wherein said flexible base, board is folding around said sonic transducer parts, and its first covers and be attached to said exterior top surface;

    And its second portion covers and is attached to said outside bottom surface at least in part, and wherein said flexible base, board is provided with the conductive trace that exposes and be connected at least one electric terminal in first on away from a side of said outer cover.

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