Polishing composition

Polishing composition

  • CN 102,741,370 A
  • Filed: 01/28/2011
  • Published: 10/17/2012
  • Est. Priority Date: 02/03/2010
  • Status: Active Application
First Claim
Patent Images

1. composition for polishing, it comprisesColloidal silica, and additive, said additive-package are contained in the ionogen or the said electrolytical salt of release hydrogen ions in the aqueous solution.

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