Composition for polishing

Composition for polishing

  • CN 102,741,370 B
  • Filed: 01/28/2011
  • Issued: 10/14/2015
  • Est. Priority Date: 02/03/2010
  • Status: Active Grant
First Claim
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1. for grinding SiO xthe composition for polishing of (0<

  • x≤

    2), described composition for polishing is made up of following;

    Colloidal silica,Additive, described additive is made up of the ionogen of release hydrogen ions in aqueous or described electrolytical salt;

    AndWaterWherein, the relative concentration of described colloidal silica is greater than 20 % by weight in described composition for polishing entirety, andThe relative concentration of described additive in described composition for polishing entirety be less than 1 % by weight.

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