Photosensitive resin composition, photosensitive dry film, and pattern forming method

Photosensitive resin composition, photosensitive dry film, and pattern forming method

  • CN 102,741,750 A
  • Filed: 12/27/2010
  • Published: 10/17/2012
  • Est. Priority Date: 12/28/2009
  • Status: Active Application
First Claim
Patent Images

1. photosensitive polymer combination, it comprises:

  • the monomer mixture that will comprise monomer (a) with phenol property hydroxyl carry out polymerization and vinyl based polymer (I);

    The monomer mixture that will comprise the ethene base system monomer (b) that contains carboxyl carry out polymerization and, the matter average molecular weight is 20,000~

    100,000 vinyl based polymer (II) (wherein, except the said vinyl based polymer (I));

    Quinone di-azido compound (III);

    And the compound (IV) shown in the following formula (5),

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