Multilayer stacked circuit arrangement with localized separation section

Multilayer stacked circuit arrangement with localized separation section

  • CN 102,752,955 A
  • Filed: 06/08/2011
  • Published: 10/24/2012
  • Est. Priority Date: 04/20/2011
  • Status: Active Application
First Claim
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1. the multilayer superimposed circuit winding displacement with local detachment section is characterized in that, said multilayer superimposed circuit winding displacement with local detachment section comprises:

  • One first parallel conductor layout;

    Extend with a bearing of trend;

    Said first parallel conductor layout definition has at least one first separate sections, at least one first non-separate sections and an extension of section, wherein has a non-separate sections at least between said separate sections and said extension of section;

    A plurality of conductive feet position is laid in the extension of section of said first parallel conductor layout;

    Many first signal transmssion lines are formed on said first parallel conductor layout;

    At least one second parallel conductor layout;

    Extend with said bearing of trend;

    The definition of said second parallel conductor layout has at least one second separate sections and at least one second non-separate sections, and second separate sections of said second parallel conductor layout and the second non-separate sections are first separate sections and the first non-separate sections that is stacked and placed on said first parallel conductor layout with the stacked direction correspondence perpendicular to said bearing of trend;

    One bond material layer;

    Be formed between the second non-separate sections of the first non-separate sections and said second parallel conductor layout of said first parallel conductor layout;

    In order to said first parallel conductor layout and the stacked location of said second parallel conductor layout, and keep separating between second separate sections of first separate sections that makes said first parallel conductor layout and said second parallel conductor layout;

    Many secondary signal transmission lines are formed on said second parallel conductor layout;

    At least one conductive through hole;

    Connect first non-separate sections of said first parallel conductor layout and the second non-separate sections of said second parallel conductor layout, at least a portion secondary signal transmission line of said second circuit winding displacement is connected to first signal transmssion line of said first circuit cable via said conductive through hole.

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