The supporting construction and grasping system of semiconductor devices in wire and ribbon bonding

The supporting construction and grasping system of semiconductor devices in wire and ribbon bonding

  • CN 102,770,950 B
  • Filed: 11/16/2010
  • Issued: 10/31/2017
  • Est. Priority Date: 11/17/2009
  • Status: Active Grant
First Claim
Patent Images

1. a kind of wire type jointing machine, including:

  • Supporting construction, for supporting semiconductor devices, the support during the wire type bonding operation of the wire type jointing machineStructure includes main part, and the main part has upper surface, and the upper surface is configured as in the wire type bonding operation processThe middle support semiconductor devices, the upper surface defines confinement element, and the confinement element is used in wire type engagementRow constraint is entered at least a portion of the semiconductor devices in operating process;

    WithGrasping system, for the semiconductor devices to be fixed into the supporting construction during the wire type bonding operation,Wherein described confinement element is included in lug boss raised on the upper surface, so that in the wire type bonding operation processIn row constraint is entered to the part of the semiconductor devices,Wherein, the part that the confinement element is configured as at least one direction to the semiconductor devices is carried out aboutBeam,Wherein, at least one described direction includes the engagement instrument movement of wire type jointing machine to carry out the direction that ultrasonic wave washes away.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×