Semiaromatic polyamide molding compositions and their use

Semiaromatic polyamide molding compositions and their use

CN
  • CN 102,816,429 A
  • Filed: 05/04/2008
  • Published: 12/12/2012
  • Est. Priority Date: 05/03/2007
  • Status: Active Application
First Claim
Patent Images

1. polyamide moulding composition with following composition:

  • (A) at least a copolyamide 10T/6T of 30~

    100wt%, it is made up of following component;

    (A1) the 10T unit that forms by monomer 1 and terephthalic acid of 40~

    95mol%,(A2) 5~

    60mol% by monomer 1, the 6T unit that 6-hexanediamine and terephthalic acid form;

    (B) strongthener of 0~

    70wt% and/or filler;

    (C) additive of 0~

    50wt% and/or other polymkeric substance;

    Wherein component A to C altogether 100%,Prerequisite is based on whole dicarboxylicacid, and in component (A), independently of each other, at (A1) and/or (A2), the terephthalic acid of 30mol% can be had other aromatics, aliphatics or cycloaliphatic dicarboxylic acid'"'"'s replacement of 6~

    36 carbon atoms at the most,And prerequisite is based on whole diamines, in component (A), independently of each other, and at (A1) and/or (A2), the 1 of 30mol% and 1 at the most, other diamines that the 6-hexanediamine can be had 4~

    36 carbon atoms respectively replaces,And prerequisite is based on whole monomers, and being no more than 30mol% in the component (A) can form through lactan or amino acid,And prerequisite is based on employed whole monomers among the component A, replaces terephthalic acid, 1, and the whole monomeric concentration of 6-hexanediamine and 1 is no more than 30mol%.

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