Curable resin composition, dry film using same, and printed wiring board

Curable resin composition, dry film using same, and printed wiring board

  • CN 102,822,284 B
  • Filed: 03/28/2011
  • Issued: 02/22/2017
  • Est. Priority Date: 03/31/2010
  • Status: Active Grant
First Claim
Patent Images

1. a kind of white film layer formation hardening resin composition is it is characterised in that contain:

  • Containing carboxy resin,Titanium Dioxide Rutile Top grade,Metal phosphinate,Epoxy resin,Acylphosphine oxide system Photoepolymerizationinitiater initiater andThe phosphorus compound as fire retardant beyond metal phosphinate,The phosphorus compound as fire retardant beyond described metal phosphinate is to close selected from having acrylate-based phosphatizationOne or more of the group that thing, the phosphorus compound with phenolic hydroxyl group, phosphorus element-containing polyester polymers, Phosphazene oligomers are constitutedCompound,The compounding amount of described metal phosphinate is 5~

    70 mass parts with respect to containing carboxy resin described in 100 mass parts, describedThe compounding amount of Titanium Dioxide Rutile Top grade is 5~

    300 mass parts with respect to containing carboxy resin described in 100 mass parts.

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