Liquid resin composition for electronic components and electronic component device

Liquid resin composition for electronic components and electronic component device

CN
  • CN 102,850,721 A
  • Filed: 11/24/2006
  • Published: 01/02/2013
  • Est. Priority Date: 11/25/2005
  • Status: Active Application
First Claim
Patent Images

1. an electronic component liquid resin composition is characterized in that, contains:

  • (A) Resins, epoxy,(B) under the normal temperature for liquid and anhydride equivalent be more than 200 cyclic acid anhydride,(C) coupling agent.

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