Machine and method for molding semiconductor device

Machine and method for molding semiconductor device

  • CN 102,856,217 A
  • Filed: 06/30/2011
  • Published: 01/02/2013
  • Est. Priority Date: 06/30/2011
  • Status: Active Application
First Claim
Patent Images

1. device that utilizes molding compounds to seal lead frame assembly, wherein said lead frame assembly comprise array of leadframes and attached and electrically be connected to a plurality of semiconductor elements of corresponding lead frame, and described device comprises:

  • Mold frame and bed die frame, can be aligned with each other, each of wherein said mold frame and bed die frame comprises the multiple row cavity, and every row cavity is used for holding a plurality of lead frames of described array of leadframes, thus so that each lead frame in the row forms the row of crossing over a plurality of row;

    At least one container is used for the storage molding compounds;

    WithA plurality of passages are connected to described at least one container with the multiple row cavity, and wherein each passage is connected to accordingly wherein row;

    AndWherein said molding compounds is listed as to each via a plurality of channel flow from described container, and flow to subsequently on each lead frame assembly in the row.

View all claims

    Thank you for your feedback