Thermal interfacial material with good reliability

Thermal interfacial material with good reliability

  • CN 102,893,391 B
  • Filed: 04/29/2011
  • Issued: 08/29/2017
  • Est. Priority Date: 04/30/2010
  • Status: Active Grant
First Claim
Patent Images

1. thermal interfacial material, including:

  • Water permeability coefficient is less than 10 under standard temperature and pressure (STP)-11cm3cm/cm2S Pa first polymer;

    Oxygen permeability coefficient is less than 10 under standard temperature and pressure (STP)-14cm3cm/cm2S Pa second polymer;

    Antioxidant;

    WithHeat filling;

    Wherein described first polymer is selected from polyolefin, polyalkane, polyamide, poly- 1,1- dichloroethylene, CTFE -1,1-Fluoride copolymers, ethylene-chlorotrifluoro-ethylene copolymer, ethylene-tetrafluoroethylene copolymer, fluorinated ethylene-propylene copolymer,Perfluoroalkyl-TFE copolymer, poly- 1,1- difluoroethylenes, hexafluoropropylene (HFP)/tetrafluoroethylene (TFE) -1,1- difluoroethylenes trimer,Hexafluoropropene -1,1- fluoride copolymers and tetrafluoroethylene-perfluoro methyl ether copolymer;

    And the second polymer is selected fromPolymethacrylates, polynitriles, polydiene, polyester, cellulose and glassine paper.

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