Adhesive tape coating bonding device taking fabric as substrate and application thereof

Adhesive tape coating bonding device taking fabric as substrate and application thereof

  • CN 102,896,872 A
  • Filed: 10/15/2012
  • Published: 01/30/2013
  • Est. Priority Date: 10/15/2012
  • Status: Active Application
First Claim
Patent Images

1. adhesive tape coating bonder take fabric as substrate, it is characterized in that:

  • this device is comprised of three systems;

    automatically watering system I, coating system II, bonding system III.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×