Device for laminated virtual mask and integration method of silicon photonics integrated chip

Device for laminated virtual mask and integration method of silicon photonics integrated chip

  • CN 102,902,165 B
  • Filed: 09/21/2012
  • Issued: 01/21/2015
  • Est. Priority Date: 09/21/2012
  • Status: Active Grant
First Claim
Patent Images

1. the method for the device integrated silicon photon integrated chip of lamination dummy mask version, the device of described lamination dummy mask version, comprise:

  • camera installation, picture reproducer, computing machine, chip fixture, chip position control desk, silicon photon platform, it is characterized in that;

    camera installation is arranged on directly over silicon photon platform, chip position control desk is arranged on silicon photon platform side, chip fixture is arranged on chip position control desk, and computing machine is connected with camera installation, picture reproducer, chip position control desk respectively;

    It is characterized in that according to the following steps;

    1) camera installation is taken a picture to the silicon substrate on silicon photon platform and is recorded its actual size and dimension and is transferred to computing machine, and the image of silicon substrate and size are made the dummy mask version of silicon substrate and shown on picture reproducer by computing machine;

    2) camera installation extracts image and the size of corresponding light chip/optical device on silicon photon platform or electrical chip/electrical part, is transferred in computing machine, generates corresponding dummy mask version and show on picture reproducer by computing machine in conjunction with silicon photon design drawing;

    3) the dummy mask version of multiple dummy mask version and silicon substrate is carried out aligning superposition based on the public aligning mark on silicon photon platform by computing machine, forms lamination dummy mask version and shows on picture reproducer;

    4) lamination dummy mask version records the mark of physical size shape of silicon substrate, all chip/devices, realizes on computers all chip/devices high precision alignment on a silicon substrate and consolidation and shows on picture reproducer;

    5) computing machine transforms the precision of lamination dummy mask version on the chip/device of actual silicon photon platform by controlling the chip fixture be arranged on chip position control desk, and aims at and consolidation, obtains high-precision silicon photon integrated chip.

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