Method and system for mfg. semiconductor devices

Method and system for mfg. semiconductor devices

  • CN 1,029,442 C
  • Filed: 11/12/1986
  • Issued: 08/02/1995
  • Est. Priority Date: 11/12/1985
  • Status: Active Grant
First Claim
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1. , semiconductor device manufacturing system is made up of a plurality of CVD system, comprising:

  • One has a CVD system of first reative cell that can carry out CVD technology within it;

    One has the 2nd CVD system of second reative cell that can carry out microwave enhanced CVD technology within it, and said first and second reative cells can interconnect under air-proof condition, are added with a magnetic field in said second reative cell;

    One is used for fixing the ring-type substrate holder of substrate;

    WithOne transfer device is used for said clamper is being delivered under the air-proof condition within said second reative cell from the said first reative cell inside.

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