Back-to-back stacked dies

Back-to-back stacked dies

  • CN 102,956,629 A
  • Filed: 06/06/2012
  • Published: 03/06/2013
  • Est. Priority Date: 08/17/2011
  • Status: Active Application
First Claim
Patent Images

1. circuit, it comprises:

  • The first chip, it has source and dorsal part is arranged, and wherein said the first chip is installed to carrier in the flip chip mode;

    AndThe second chip, it is stacked on the described dorsal part of described the first chip, wherein said second is chip-stacked on described the first chip, so that the dorsal surface of described the second chip is to the described dorsal part of described the first chip, and described the second chip has source back to described the first chip.

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