Chip module and method for fabricating a chip module

Chip module and method for fabricating a chip module

  • CN 103,021,980 A
  • Filed: 09/21/2012
  • Published: 04/03/2013
  • Est. Priority Date: 09/21/2011
  • Status: Active Application
First Claim
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1. chip module comprises:

  • Semiconductor chip, described semiconductor chip have at the first contact element on the first interarea and the second contact element on the second interarea;

    Carrier, wherein said semiconductor chip is arranged on the described carrier by this way, so that described first interarea of described semiconductor chip is in the face of described carrier;

    WithBe connected to one or more electric connector of described carrier, each electric connector comprises the end face in the plane of plane top of described the second interarea that is located at described semiconductor chip.

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