Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board

Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board

  • CN 103,064,250 A
  • Filed: 06/16/2009
  • Published: 04/24/2013
  • Est. Priority Date: 06/18/2008
  • Status: Active Application
First Claim
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1. photosensitive polymer combination, it is characterized in that, contain (A) binder polymer, (B) and have the optical polymerism compound of at least one ethene unsaturated link and (C) Photoepolymerizationinitiater initiater, described (C) Photoepolymerizationinitiater initiater contains the compound of following general formula (I) expression and the compound of following general formula (II) expression

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