Semiconductor package having solder jointed region with controlled ag content

Semiconductor package having solder jointed region with controlled ag content

  • CN 103,066,050 A
  • Filed: 02/21/2012
  • Published: 04/24/2013
  • Est. Priority Date: 10/21/2011
  • Status: Active Application
First Claim
Patent Images

1. semiconductor package part comprises:

  • Workpiece comprises conductive trace;

    AndChip comprises projection cube structure,Wherein, described chip attach is to described workpiece, and described projection cube structure is electrically connected to described conductive trace, thereby forms trace upper protruding block (BOT) interconnection structure;

    AndWherein, described BOT interconnection structure comprises the scolder zone, and silver (Ag) content in the described scolder zone is no more than 1.8 percentage by weights (wt%).

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