Epoxy compounds, solidification compound and cured article thereof

Epoxy compounds, solidification compound and cured article thereof

  • CN 103,097,426 B
  • Filed: 08/03/2011
  • Issued: 03/02/2016
  • Est. Priority Date: 08/19/2010
  • Status: Active Grant
First Claim
Patent Images

1. new epoxy compound, it has the resin structure shown in following structural formula 1,[chemical formula 1]

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