Positive photosensitive resin composition, method of creating resist pattern, and electronic component

Positive photosensitive resin composition, method of creating resist pattern, and electronic component

  • CN 103,097,954 A
  • Filed: 09/02/2011
  • Published: 05/08/2013
  • Est. Priority Date: 09/16/2010
  • Status: Active Application
First Claim
Patent Images

1. positive type photosensitive organic compound, contain:

  • Have phenolic hydroxyl group alkali soluble resins,Compound by photogenerated acid,Thermal cross-linking agent andSilane compound with at least a functional group of the epoxy radicals of being selected from and thioether group.

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