A kind of manufacture method of semiconductor devices

A kind of manufacture method of semiconductor devices

  • CN 103,151,264 B
  • Filed: 12/06/2011
  • Issued: 06/13/2017
  • Est. Priority Date: 12/06/2011
  • Status: Active Grant
First Claim
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1. a kind of manufacture method of semiconductor devices, including:

  • Semiconductor substrate is provided, grid structure is formed with the semiconductor substrate;

    Bowl-shape groove is formed in the source/drain region of the Semiconductor substrate;

    Implement dry etching carries out longitudinal etching to the bowl-shape groove, with flat in the formation one of the bottom section of the bowl-shape grooveCunette groove;

    The bowl-shape groove is etched, to form ∑

    shape groove;

    Embedded germanium silicon layer is formed in the ∑

    shape groove and the flat groove.

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