Process for producing circuit carrier

Process for producing circuit carrier

  • CN 103,154,135 B
  • Filed: 03/16/2012
  • Issued: 10/15/2014
  • Est. Priority Date: 03/18/2011
  • Status: Active Grant
First Claim
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1. produce the method for circuit carrier, moulding part providing containing thermoplastic compounds is provided for it, and adopts the upper region that will formation conducting wire of its of parts described in laser radiation irradiation, and subsequently to metallized by irradiation zone,Wherein said thermoplastic compounds comprises:

  • A) thermoplastic resin, andB) the laser direct forming additive existing with the amount of at least 1wt% of the weight with respect to total composition, described laser direct forming additive-package is containing antimony doped tin oxide and have at least 45 CIELab color value L*.

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