Waterfall wire bonding

Waterfall wire bonding

  • CN 103,155,143 A
  • Filed: 05/18/2011
  • Published: 06/12/2013
  • Est. Priority Date: 05/18/2011
  • Status: Active Application
First Claim
Patent Images

1. Bonding structure comprises:

  • Bond pad;

    WithContinuous lead-in wire, with the counterdiffusion of bond pad phase, described lead-in wire electrically contacts described bond pad and first with second and electrically contacts and be electrically connected to, second electrically contact from first electrically contact different.

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