Liquid resin composition used for electronic component and manufacturing method thereof, and electronic component device

Liquid resin composition used for electronic component and manufacturing method thereof, and electronic component device

  • CN 103,183,925 A
  • Filed: 09/25/2012
  • Published: 07/03/2013
  • Est. Priority Date: 12/27/2011
  • Status: Active Grant
First Claim
Patent Images

1. electronic component-use liquid resin composition, described electronic component-use liquid resin composition is to contain Resins, epoxy, 25 ℃

  • down for the cyclic acid anhydride of liquid with have the particle of core shell structure, and uses 25 ℃

    viscosity of EMD type rotary viscosity design determining to be the electronic component-use liquid resin composition below the 1.2Pas.

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