The method and apparatus for reducing strain for package-on-package device

The method and apparatus for reducing strain for package-on-package device

  • CN 103,187,405 B
  • Filed: 05/29/2012
  • Issued: 09/14/2018
  • Est. Priority Date: 01/03/2012
  • Status: Active Grant
First Claim
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1. a kind of semiconductor device structure, including:

  • First ic package includes arrangement at least one integrated circuit device on the first substrate, and with fromThe bottom surface of first substrate extends and the pattern to be made of the row or multiple row of the periphery of neighbouring first substrateMultiple laminate packaging connectors of arrangement;

    AndSecond ic package, including at least one other integrated circuit device for being arranged on the second substrate, including evenIt is connected to the multiple laminate packaging connector, multiple engagement disks on the upper surface of second substrate, and further includesThe multiple joint outer parts for extending from the bottom surface of second ic package and being arranged with comb mesh pattern;

    Wherein, the pattern of the joint outer part is aligned with the pattern of the laminate packaging connector, but describedThe pattern of joint outer part in the corner of second substrate do not have the joint outer part so that along perpendicular toFirst and second substrate is simultaneously parallel in the section of direction interception of first and second ic package, outermostThe laminate packaging connector of the row in face is located at except the region of the joint outer part of outmost row, also, describedInterval between multiple joint outer parts is identical as the interval between the multiple laminate packaging connector;

    The wherein described semiconductor device structure further includes the molded bottom filler on the upper surface of second substrateLayer.

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