The manufacturing method of light emitting device and wiring board

The manufacturing method of light emitting device and wiring board

  • CN 103,210,512 B
  • Filed: 11/02/2011
  • Issued: 11/26/2019
  • Est. Priority Date: 11/11/2010
  • Status: Active Grant
First Claim
Patent Images

1. a kind of light emitting device, has:

  • Light-emitting component;

    Encapsulation, be made of formed body, at least first lead being embedded in the formed body and the second lead, have bottom surface,It is the upper surface of opposite with the bottom surface, with the bottom surface and the light-emitting face being connected above,The first lead have the first end sub-portion that the bottom surface is exposed, the exposed division exposed above described, with it is describedFirst terminal part from and the base portion exposed of the bottom surface,The position that the center side of the encapsulation is more leaned on than the first end sub-portion is arranged in the exposed division,In the case where above described in the overlook view, the exposed division is surrounded by the formed body,The first lead has the interconnecting piece being integrally formed with the first end sub-portion, the exposed division and the base portion,The interconnecting piece forms plate, configures along the light-emitting face,The exposed division exposes in the upper surface of interconnecting piece central portion from the formed body, is formed in the upper surface of described interconnecting pieceCentre portion.

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