Method and system for thin multi chip stack package with film on wire and copper wire

Method and system for thin multi chip stack package with film on wire and copper wire

  • CN 103,250,246 A
  • Filed: 06/29/2011
  • Published: 08/14/2013
  • Est. Priority Date: 06/29/2010
  • Status: Active Application
First Claim
Patent Images

1. device comprises:

  • Substrate;

    First chip, it is located at this substrate top;

    Copper cash, it electrically connects this first chip to this substrate;

    Film, it is located at the part top of this first chip and this copper cash;

    AndSecond chip, it is located at this film top,Wherein, this film is electrically insulated this copper cash and this second chip.

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