Binding equipment and binding method of chip

Binding equipment and binding method of chip

  • CN 103,295,937 A
  • Filed: 05/21/2013
  • Published: 09/11/2013
  • Est. Priority Date: 05/21/2013
  • Status: Active Application
First Claim
Patent Images

1. the bound device of a chip comprises base station and pressure head, it is characterized in that,The one side that described base station is used for bearing substrate has the first downward radian, and the one side that described pressure head contacts with chip has the second downward radian, described base station and described pressure head coupling with second radian with first radian.

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