For making the self aligned double solder semiconductor chips of the solder projection in semiconductor assemblies, device and double solder methods

For making the self aligned double solder semiconductor chips of the solder projection in semiconductor assemblies, device and double solder methods

  • CN 103,295,991 B
  • Filed: 03/04/2013
  • Issued: 07/09/2019
  • Est. Priority Date: 03/02/2012
  • Status: Active Grant
First Claim
Patent Images

1. a kind of semiconductor chip comprising:

  • First group of electrically inactive contact pad, with by with the first volume and only with the first solder of the first melting temperatureFirst area of convex block covering, first group of electrically inactive contact pad are used as alignment pad;

    AndSecond group of electroactive contact pad, with by the second solder projection covering with the second volume and the second melting temperatureSecond area;

    First melting temperature is lower than second melting temperature;

    Wherein the first solder and the second solder are selected from the group with appropriate pair, it is described suitably to comprising;

    the first solder be with221 DEG C of melting temperature of eutectic binary tin-silver alloy and the second solder are pair of 100 alloy of tin with 232 DEG C of melting temperature;

    First solder is the eutectic binary tin-bismuth alloy electroplating with 139 DEG C of melting temperature and the second solder is with 221 DEG C of melting temperatureEutectic binary tin-silver alloy pair;

    First solder is the eutectic binary Sn-In alloy with 120 DEG C of melting temperature and the second welderingMaterial is eutectic binary tin-silver alloy pair with 221 DEG C of melting temperature;

    AndWherein other options of first solder also include;

    with 183 DEG C of melting temperature of binary eutectic tin-lead alloys, toolHave 198.5 DEG C of melting temperature of binary eutectic tin-zinc alloy, with 217 DEG C of melting temperature of binary eutectic tin-billons andWith 227 DEG C of melting temperature of binary eutectic tin-copper alloy.

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