Manufacturing method of whole addition circuit board without photoresist

Manufacturing method of whole addition circuit board without photoresist

  • CN 103,338,596 A
  • Filed: 06/18/2013
  • Published: 10/02/2013
  • Est. Priority Date: 06/18/2013
  • Status: Active Application
First Claim
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1. a full addition method for manufacturing circuit board with photoresist not, it is characterized in that seeing through mask with vacuum ultraviolet light source, irradiate the conducting polymer film that invests substrate surface, at substrate surface structure conductive pattern line, change into copper cash figure line through the heavy copper of electrochemistry, make described wiring board.

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