Stacked semiconductor package

Stacked semiconductor package

  • CN 103,367,178 A
  • Filed: 03/27/2013
  • Published: 10/23/2013
  • Est. Priority Date: 03/27/2012
  • Status: Active Application
First Claim
Patent Images

1. method of making Stacked semiconductor package, described Stacked semiconductor package has lead frame at least, be installed on described lead frame top and be welded to the first nude film of described lead frame and be installed on described the first nude film top and be welded to the first anchor clamps of described the first nude film, and described method comprises:

  • With vertical stacking relation location described lead frame, the first nude film and the first anchor clamps;

    AndLocking described the first anchor clamps with non-welding manner with respect to the relation of described lead frame transverse shift.

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