Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution

Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution

  • CN 103,384,913 A
  • Filed: 10/21/2011
  • Published: 11/06/2013
  • Est. Priority Date: 12/17/2010
  • Status: Active Application
First Claim
Patent Images

1. micromodule comprises:

  • Dielectric element, described dielectric element have first surface and second surface and first hole of extending and the second hole of relatively facing between described first surface and described second surface, described dielectric element further has a plurality of conducting elements thereon;

    The first microelectronic element, described the first microelectronic element have the rear surface and in the face of the front surface of described dielectric element, and described the first microelectronic element has a plurality of contacts that are exposed to its front surface place;

    The second microelectronic element, described the second microelectronic element has the rear surface and faces the front surface of the described rear surface of described the first microelectronic element, and described the second microelectronic element has a plurality of contacts outside the edge that is exposed to described front surface place and protrudes from described the first microelectronic element;

    Signal lead, described signal lead are connected to one or more described microelectronic elements, and extend through described the first hole some described conducting elements to the described dielectric element;

    AndConductive plane, described conductive plane is attached to described dielectric element, and be positioned at least in part between described the first hole and described the second hole, described conductive plane is electrically connected to the one or more described contact of at least one described the first microelectronic element or described the second microelectronic element.

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