Infrared sensor

Infrared sensor

  • CN 103,575,388 A
  • Filed: 08/07/2013
  • Published: 02/12/2014
  • Est. Priority Date: 08/08/2012
  • Status: Active Application
First Claim
Patent Images

1. an infrared sensor, comprising:

  • Circuit board, described circuit board has top major surface, and described top major surface is formed with a plurality of electrodes;

    At least two support portions, each support portion in the vertical direction has upper surface and lower surface, each support portion also has the upper conductive pattern being formed on this upper surface and is formed on the lower conductive pattern on this lower surface, described upper conductive pattern is electrically connected to described lower conductive pattern, and described lower conductive pattern is connected to the electrode of the top major surface of circuit board;

    FET element, described FET element is between described at least two support portions and be disposed on the top major surface of circuit board;

    Thermoelectric element, described thermoelectric element is electrically connected to the upper conductive pattern of described support portion, and described thermoelectric element is supported to be positioned at the top of described FET element by described support portion.

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