Method for electroless copper plating on glass substrate

Method for electroless copper plating on glass substrate

  • CN 103,613,289 A
  • Filed: 11/22/2013
  • Published: 03/05/2014
  • Est. Priority Date: 11/22/2013
  • Status: Active Application
First Claim
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1. a method for electroless copper on glass substrate, is characterized in that, the method comprises:

  • on glass substrate, apply one deck organic film, adopt traditional chemical copper-plating technique method copper layer after drying again;

    Wherein organic film preparation method comprises the following steps;

    (1) organic film material is dissolved in volatile organic solvent with 0.1%-20% volume percent;

    (2) described organic solvent is coated on glass substrate with spin coating, spraying, immersion or brushing method;

    (3) glass substrate of described organic solvent to be coated is dried or is dried;

    (4) glass substrate is adopted the material behavior of organic film material carry out imidization or hot setting.

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