Heat sink for cooling of power semiconductor modules

Heat sink for cooling of power semiconductor modules

  • CN 103,620,765 A
  • Filed: 07/02/2012
  • Published: 03/05/2014
  • Est. Priority Date: 06/30/2011
  • Status: Active Application
First Claim
Patent Images

1. a radiator, for cooling at least one power semiconductor modular with base plate, described radiator comprises:

  • Basin, it is for comprising cooling liquid;

    Engagement edge, it is positioned at described basin around and holds described base plate, and described engagement edge has the inside inclined-plane towards described basin.

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