Carrier warpage control for three dimensional integrated circuit (3DIC) stacking

Carrier warpage control for three dimensional integrated circuit (3DIC) stacking

  • CN 103,632,987 A
  • Filed: 05/14/2013
  • Published: 03/12/2014
  • Est. Priority Date: 08/24/2012
  • Status: Active Grant
First Claim
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1. form a method for encapsulation stacking (PoP) device, comprising:

  • Interim mounting substrates on carrier;

    Stacking the first tube core on described substrate, at least one in described the first tube core and described substrate has the thermal coefficient of expansion with described carrier mismatch;

    AndStacking the second tube core on described the first tube core.

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