Light emitting package and method for manufacturing light emitting package

Light emitting package and method for manufacturing light emitting package

  • CN 103,633,228 A
  • Filed: 04/25/2005
  • Published: 03/12/2014
  • Est. Priority Date: 04/26/2004
  • Status: Active Application
First Claim
Patent Images

1. for the manufacture of a method for light emitting package, described method comprises:

  • At least one luminous die is mechanically attached to and is electrically connected to printed circuit board (PCB);

    Diffuser is fixed to described printed circuit board (PCB), and described diffuser covers described at least one luminous die, and fixing described diffuser and described printed circuit board (PCB) limit internal capacity jointly;

    Sealant is arranged in described internal capacity, and the setting of described sealant comprises;

    before fixing described diffuser, be sealed in described at least one luminous die on described printed circuit board (PCB);

    AndFluorescer is arranged on described diffuser or among.

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