Method for forming tin solder durable figures with photosensitive thermosetting resin composition

Method for forming tin solder durable figures with photosensitive thermosetting resin composition

  • CN 1,036,693 C
  • Filed: 03/24/1993
  • Issued: 12/10/1997
  • Est. Priority Date: 11/30/1987
  • Status: Active Grant
First Claim
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1. anti-scolding tin method of patterning of making printed circuit board (PCB), this method comprises:

  • A kind of photosensitive thermosetting resin composition is applied on the surface of described printed circuit board (PCB), described photosensitive thermosetting resin composition contains (A) a kind of photosensitive prepolymer that has at least two ethylenic unsaturated bonds in its molecular cell, (B) a kind of photo-induced polymerization initiator, (C) a kind of vinyl monomer of photopolymerizable thing and/or a kind of organic solvent as diluent, (D) a kind of fine powdered epoxy compounds that in its molecular cell, has at least two epoxy radicals and be slightly soluble in used diluent, also can choose wantonly and contain (E) a kind of curing agent for epoxy resin that is used for, mixing ratio (the A;

    D) be 50-95;

    50-5 (weight) of wherein said photosensitive prepolymer (A) and described fine powdered epoxy compounds (D), the consumption of described diluent, count 20-300 part (weight) with 100 parts of described photosensitive prepolymers of weight, described light trigger consumption is counted 0.2-30 part (weight) with 100 parts of described photosensitive prepolymers of weight;

    The coating of described composition is carried out the selectivity exposure by an optical masking mould that has predetermined pattern under actinic ray;

    Develop with the unexposed portion of a kind of developer solution with above-mentioned coating, thereby get a kind of pattern of anti-scolding tin, wherein developer solution is at least a following material that is selected from;

    Cyclohexanone, dimethylbenzene, durene, butyl cellosolve, butyl carbitol, propylene glycol monomethyl ether, the aqueous solution of the trichloroethanes of cellosolve acetate, propyl alcohol, propylene glycol, trichloroethanes, trichloroethylene, modification, potassium hydroxide aqueous solution, sodium hydrate aqueous solution, aqueous sodium carbonate, wet chemical, sodium phosphate aqueous solution, sodium silicate aqueous solution, ammonia spirit, amine aqueous solution and surfactant;

    Mode with heating is solidified described fine powdered epoxy compounds.

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