Method for etching cutting of glass substrate

Method for etching cutting of glass substrate

  • CN 103,693,855 A
  • Filed: 09/27/2012
  • Published: 04/02/2014
  • Est. Priority Date: 09/27/2012
  • Status: Active Application
First Claim
Patent Images

1. for the method for glass-cutting base material, the method comprises:

  • (i) provide glass baseplate;

    (ii) with protective membrane, cover described glass baseplate;

    (iii) glass baseplate that described in patterning, protective membrane covers to obtain part, the glass baseplate that wherein said part covers is to comprise shaded areas and exposed region;

    (iv) with etching cutting solution, at 10 ℃

    ~ 900 ℃

    , contact the glass baseplate 1 minute ~ 120 minutes that described part covers;

    (v) water cleans the glass baseplate through contact;

    (vi) the dry glass baseplate through cleaning;

    With(vii) remove the protective membrane on the described glass baseplate of step (vi);

    Wherein, the cutting of the etching described in step (iv) solution comprises;

    (a) hydrofluoric acid of 10.1 % by weight ~ 20 % by weight;

    (b) oxyacetic acid of 5 % by weight ~ 20 % by weight;

    (c) nitric acid of 0 % by weight ~ 30 % by weight;

    With(d) water of 30 % by weight ~ 84.9 % by weight;

    Wherein, described weight percentage is the gross weight based on described etching cutting solution, and described etching cutting solution fluorinated ammonium not substantially.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×