Method for providing organic resist adhesion to a copper or copper alloy surface

Method for providing organic resist adhesion to a copper or copper alloy surface

  • CN 103,703,164 A
  • Filed: 06/29/2012
  • Published: 04/02/2014
  • Est. Priority Date: 07/07/2011
  • Status: Active Application
First Claim
Patent Images

1. the method that improves the adhesion of organic anticorrosive additive material on copper or copper alloy surface, said method comprising the steps of:

  • A., the substrate with copper or copper alloy surface is provided,B. make described Surface Contact water-based adhere to and strengthen solution, described water-based adheres to enhancing solution and comprises;

    I. at least one organic acid, andIi. peroxide compound,Wherein said at least one organic acid concentration, or in more than a kind of organic acid situation all organic acid total concns, be 0.005 to 0.04 mole/L, thereby on copper or copper alloy surface, form the layer of one or more cupric oxide phases, andC. make organic anticorrosive additive material be attached on the layer of described one or more cupric oxide phases.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×