Grinding wheel for wafer edge trimming

Grinding wheel for wafer edge trimming

  • CN 103,707,177 A
  • Filed: 01/18/2013
  • Published: 04/09/2014
  • Est. Priority Date: 08/16/2012
  • Status: Active Grant
First Claim
Patent Images

1. for an abrasive wheel for crystal round fringes finishing, comprising:

  • Head, has open side;

    AndAbrasive tip, is engaged to the edge of the open side of described head;

    Wherein, described abrasive tip is arranged to around crystal round fringes, to have a plurality of synchronous contacts during described crystal round fringes finishing.

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