Dual-phase intermetallic interconnection structure and method of fabricating the same

Dual-phase intermetallic interconnection structure and method of fabricating the same

  • CN 103,715,178 A
  • Filed: 11/15/2012
  • Published: 04/09/2014
  • Est. Priority Date: 10/08/2012
  • Status: Active Application
First Claim
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1. two-phase Jie metal interconnect structure, between a chip and a support plate, is characterized in that described structure comprises:

  • First Jie'"'"'s Metal Phase;

    Second Jie'"'"'s Metal Phase, coated this first Jie Metal Phase, and this first Jie Metal Phase contains respectively different refractory metals from this second Jie Metal Phase;

    AndThe first weld metal layers and the second weld metal layers, be disposed at respectively the relative both sides of this second Jie Metal Phase;

    Wherein this first Jie Metal Phase is the micropore hole defect producing because of volume contraction while filling up this second Jie Metal Phase formation.

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