Halogen-free epoxy resin composition and application thereof

Halogen-free epoxy resin composition and application thereof

  • CN 103,724,944 A
  • Filed: 12/31/2013
  • Published: 04/16/2014
  • Est. Priority Date: 12/31/2013
  • Status: Active Application
First Claim
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1. a halogen-free epoxy resin composition, is characterized in that, in organic solid substance weight part, it comprises:

  • (A) halogen-free epoxy resin of 100 weight parts;

    (B) vinylbenzene and copolymer-maleic anhydride be as the first solidifying agent, and the halogen-free epoxy resin of 100 weight parts of take is benchmark, and the content of this vinylbenzene and copolymer-maleic anhydride is 50~

    300 weight parts;

    (C) P contained compound is the second solidifying agent, the halogen-free epoxy resin of 100 weight parts of take is benchmark, the content of this P contained compound is 1.0~

    20 weight parts, described P contained compound be by contain be selected from least one organo phosphorous compounds of H-P=O, P-H or P-OH group and at least one have chemical structural formula [K '"'"' (Y) a '"'"'] a(X-O-R '"'"' '"'"') bcompound reaction and obtain;

    Wherein, K '"'"' is organic group, and Y is selected from hydroxyl, carboxylic acid, carboxylicesters, acid anhydrides, amine ,-SH ,-SO 3h ,-CONH 2,-NHCOOR 1, phosphinate and phosphoric acid ester functional group;

    X is alkylene;

    R '"'"' '"'"' is hydrogen or the replacement with 1-8 carbon atom or unsubstituted alkyl;

    R 1be replacement or the unsubstituted alkyl or aryl with 1 to 12 carbon atom, and a '"'"', a and b are>

    =1 integer independently of one another.

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